ATSAMA5D22C-CUR vs ATSAMA5D225C-D1M-CU Comparaison
Comparaison détaillée côte à côte de ATSAMA5D22C-CUR par Microchip Technology et ATSAMA5D225C-D1M-CU par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
ATSAMA5D22C-CUR - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22C-CUR ✓ ActifMicrochip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ ActifComparaison des spécifications
| Paramètre | ATSAMA5D22C-CUR | ATSAMA5D225C-D1M-CU |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,50 | $12,60 |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | — |
| Largeur du bus de données | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Cache | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 128 KB | — |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC | — |
| Boîtier | 196-TFBGA (11x11 mm, 0.8 mm pitch) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| Température de fonctionnement | -40C to +85C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| Tension d'alimentation | [DATA_NEEDED: VDD_CORE / VDD_IO range] | 1.2 V core (per typical SiP) |
| Backup Mode Current | ~5 uA (with RTC retention) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Statut RoHS | Compliant | Compliant (Green, lead-free) |
| Hardware Cryptography | AES, SHA, TRNG (per datasheet) | — |
| USB | USB 2.0 High-Speed Host + Device | 1x HSIC, 1x USB 2.0 HS Host/Device |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |