EP1K30FC256-2 vs EP1K30FC256-1 Comparaison
Comparaison détaillée côte à côte de EP1K30FC256-2 par Intel et EP1K30FC256-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K30FC256-2 | EP1K30FC256-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $22,95 | $17,85 |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements | 1,728 | 17,280 |
| Typical Gates | 30,000 | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 | — |
| On-chip RAM Bits | 24,576 | — |
| User I/O Pins | 171 | 171 |
| Speed Grade | -2 | -1 (standard, slowest in family) |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 2.5 V CMOS |
| Boîtier | 256-ball FineLine BGA (FBGA) | 256-pin FineLine BGA (FBGA) |
| Nombre de broches | 256 | — |
| Configuration Method | SRAM (volatile, serial PROM or JTAG) | — |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) | — |
| Type de mémoire | Dual-port EAB blocks | — |
| Maximum Frequency | 200 MHz | — |
| Operating Temperature Grade | Commercial | Commercial (0C to +70C) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Logic Cells | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded Array Blocks (EABs) | — | 6 |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V / 2.5 V (multi-voltage) |
| Maximum Internal Frequency | — | 250 MHz (per family datasheet) |
| Configuration Interface | — | Passive Serial / Passive Parallel / JTAG |
| Programming Method | — | SRAM-based, in-system programmable |