EP1K30TI144-2 vs EP1K30TI144-3N Comparaison
Comparaison détaillée côte à côte de EP1K30TI144-2 par Intel et EP1K30TI144-3N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K30TI144-2 | EP1K30TI144-3N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $13,85 | $21,80 |
| Family | ACEX-1K | ACEX 1K |
| Series | EP1K30 | EP1K30 |
| Logic Elements / Cells | 1728 | — |
| Total RAM Bits | 24576 | — |
| Number of Logic Array Blocks (LABs) | 216 | — |
| Equivalent Gates | 30,000 | — |
| User I/O Count | 102 | — |
| Number of I/O Banks | 4 | — |
| Supply Voltage - Core | 2.5 V (2.375 V min, 2.625 V max) | — |
| Supply Voltage - I/O | 2.5 V / 3.3 V / 5.0 V (multiVolt) | — |
| Maximum Internal Frequency | 200 MHz | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.18 um CMOS, 4 metal layers |
| Embedded Memory Type | Dual-port EAB (Embedded Array Block) | — |
| Boîtier | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch | TQFP-144 (0.5 mm pitch) |
| Température de fonctionnement | -40 °C to +85 °C (Industrial, "I" suffix) | -40C to +85C (Industrial) |
| Speed Grade | -2 (mid-tier) | -3 (fastest in EP1K30 family) |
| Configuration Method | SRAM, requires external configuration PROM (EPC) | — |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP | — |
| Type de montage | Surface Mount | Surface Mount (Gull-Wing) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance - legacy part] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Usable Gates | — | 17,500 |
| Embedded Memory (EAB) | — | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | — | 102 |
| Dedicated Input Pins | — | 6 |
| Total Terminals | — | 144 |
| Core Supply Voltage | — | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Configuration Modes | — | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | — | 4 |
| Thermal Resistance (theta_JA) | — | Approximately 35-40 C/W (PCB-dependent) |