EP1K50FC256-3 vs EP1K50FC256-1N Comparaison
Comparaison détaillée côte à côte de EP1K50FC256-3 par Intel et EP1K50FC256-1N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50FC256-3 | EP1K50FC256-1N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $54,40 | $15,10 |
| Series | ACEX-1K | ACEX-1K (2.5 V) |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | 50,000 |
| Embedded RAM Bits | 40,960 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum User I/O | 186 | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 um CMOS | 0.22 um CMOS |
| Maximum Frequency | 166.67 MHz | — |
| Speed Grade | -3 | -1 (commercial) |
| Boîtier | 256-pin FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 17 x 17 mm | — |
| Température de fonctionnement | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] | 0 C to 70 C (commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster | — |
| Maximum Logic Elements | — | 2,880 |
| Maximum System Gates | — | 199,000 |
| Embedded Memory (EAB) Bits | — | 40,960 bits |
| User I/O Pins | — | 186 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Maximum Internal Frequency | — | 250 MHz |
| Typical Operating Current | — | 5 mA |
| Lead Status | — | Lead-free (-N suffix) |
| Statut RoHS | — | Compliant |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Configuration Method | — | SRAM-based, JTAG (IEEE 1149.1) |