EP1K50FC256-3AA vs EP1K50FC256-3 Comparaison
Comparaison détaillée côte à côte de EP1K50FC256-3AA par Intel et EP1K50FC256-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50FC256-3AA | EP1K50FC256-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $92,00 | $54,40 |
| Series | ACEX-1K | ACEX-1K |
| Family | ACEX 1K Device Family (2.5V) | ACEX 1K |
| Number of Logic Elements | 2880 | — |
| Number of LABs (Logic Array Blocks) | 360 | — |
| Total RAM Bits | 40960 | — |
| Number of I/O Pins | 186 | — |
| Number of Gates | 50000 (typical) | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| Température de fonctionnement | 0 °C to 70 °C (commercial) | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] |
| Speed Grade | -3 (faster tier) | -3 |
| Boîtier | 256-BGA (FBGA, 17x17 mm) | 256-pin FineLine BGA (FBGA-256) |
| Type de montage | Surface Mount | Surface Mount |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 um CMOS |
| Configuration Method | SRAM (volatile, requires external config device) | — |
| Number of PLLs | 4 (per family datasheet) | — |
| Number of Global Clocks | [DATA_NEEDED: number of global clocks] | — |
| Statut RoHS | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) | — |
| Logic Elements (LEs) | — | 2,880 |
| Typical Gates | — | 50,000 |
| Embedded RAM Bits | — | 40,960 |
| Logic Array Blocks (LABs) | — | 360 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 186 |
| Maximum Frequency | — | 166.67 MHz |
| Package Dimensions | — | 17 x 17 mm |
| Programming Interface | — | JTAG (IEEE 1149.1), ByteBlaster |