EP1SGX25DF672C5N vs EP1SGX25DF672C7 Comparaison
Comparaison détaillée côte à côte de EP1SGX25DF672C5N par Intel et EP1SGX25DF672C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1SGX25DF672C5N | EP1SGX25DF672C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 232,25 | $125,40 |
| Series | Stratix GX | Stratix GX |
| Logic Elements | 25,660 LE | — |
| User I/O Count | 455 | 455 |
| Total RAM Bits | 1,944,576 bits | 1,944,576 |
| Supply Voltage (Core) | 1.5 V (1.425 V to 1.575 V) | — |
| Transceiver Data Rate | Up to 3.1875 Gbps | — |
| Number of Transceivers | 20 | — |
| DSP Blocks | 10 (dedicated 18x18 multipliers) | — |
| Package Type | 672-ball Flip-Chip BGA (FBGA-672) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch | — |
| Température de fonctionnement | 0 C to 85 C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C5 | C7 (moderate Fmax bin) |
| Process Technology | 130 nm CMOS | 0.13 µm CMOS, SRAM-based |
| Configuration Modes | PS, PPS, FPP, JTAG | — |
| Type de montage | Surface Mount (FBGA) | Surface Mount |
| Lead Free / RoHS | Lead free per Altera/Intel datasheet | Lead-Free, RoHS Compliant |
| Family | — | Stratix GX |
| Logic Elements (LE) | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| Embedded DSP Blocks | — | 14 |
| Embedded Transceivers | — | Yes (GX family) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Boîtier | — | 672-FBGA (27 × 27 mm, 1.0 mm pitch) |
| PLL Count | — | [DATA_NEEDED: PLL count] |