EP20K100FC324-1 vs EP20K100FC324-3 Comparaison
Comparaison détaillée côte à côte de EP20K100FC324-1 par Altera et EP20K100FC324-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K100FC324-1 | EP20K100FC324-3 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $50,75 | $42,10 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | APEX-20K | APEX 20K |
| Number of Logic Elements/Cells | 4160 | — |
| Total RAM Bits | 53248 bits | — |
| Number of User I/Os | 252 | — |
| Number of LABs/CLBs | [DATA_NEEDED: Number of LABs/CLBs] | — |
| Number of Gates | [DATA_NEEDED: Number of gates] | — |
| Maximum Internal Clock Frequency | [DATA_NEEDED: fMAX] | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| I/O Supply Voltage Range | [DATA_NEEDED: I/O supply voltage range] | — |
| Boîtier / Format | 324-BGA (FC324) | — |
| Supplier Device Package | 324-FBGA | — |
| Nombre de broches | 324 | — |
| Type de montage | Surface Mount | Surface Mount |
| Plage de température de fonctionnement | 0 °C to +85 °C | — |
| Architecture | MultiCore: LUT logic + product-term logic + embedded memory | — |
| Speed Grade | -1 | -3 (slowest) |
| Configuration Memory | SRAM-based (external configuration device required) | — |
| RoHS Compliance | Unknown; lead-free -1N suffix variant exists | — |
| Family | — | APEX 20K (non-KE) |
| System Gates | — | 100,000 |
| Logic Elements | — | 4,160 |
| Maximum Logic Blocks | — | 26 |
| Embedded Memory (RAM bits) | — | 53,248 |
| User I/O Pins | — | 252 |
| Total RAM bits | — | 53,248 |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Internal Frequency | — | 167 MHz |
| Propagation Delay | — | 1.6 ns |
| Boîtier | — | 324-pin FBGA (Fine-pitch BGA) |
| Package Body Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Température de fonctionnement | — | 0 °C to 85 °C (Commercial) |
| Programming Interface | — | IEEE 1149.1 JTAG |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |