EP20K100FC324-1V vs EP20K100FC324-3 Comparaison
Comparaison détaillée côte à côte de EP20K100FC324-1V par Intel et EP20K100FC324-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K100FC324-1V | EP20K100FC324-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $118,40 | $42,10 |
| Series | APEX-20K® | APEX 20K |
| Number of Logic Elements / Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Gates (typical) | 100000 | — |
| Number of I/O | 252 | — |
| Number of LABs/CLBs | [DATA_NEEDED: number of Logic Array Blocks] | — |
| Number of EABs | [DATA_NEEDED: number of Embedded Array Blocks] | — |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V | — |
| Supply Voltage - I/O (VCCIO) | 3.0 V / 3.3 V / 5.0 V tolerant (per I/O standard) | — |
| Speed Grade | -1V (commercial) | -3 (slowest) |
| Température de fonctionnement | 0C to +85C (commercial) | 0 °C to 85 °C (Commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Boîtier / Format | 324-FBGA (FineLine BGA, 19x19 mm) | — |
| Supplier Device Package | 324-FBGA | — |
| Number of PLLs | 4 | — |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, SSTL, GTL+, HSTL | — |
| Architecture | MultiCore (LUT + product-term + embedded memory) | — |
| Programming Interface | JTAG (IEEE 1149.1) / in-system | IEEE 1149.1 JTAG |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Family | — | APEX 20K (non-KE) |
| System Gates | — | 100,000 |
| Logic Elements | — | 4,160 |
| Maximum Logic Blocks | — | 26 |
| Embedded Memory (RAM bits) | — | 53,248 |
| User I/O Pins | — | 252 |
| Total RAM bits | — | 53,248 |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage | — | 2.5 V |
| Maximum Internal Frequency | — | 167 MHz |
| Propagation Delay | — | 1.6 ns |
| Boîtier | — | 324-pin FBGA (Fine-pitch BGA) |
| Package Body Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |