EP20K400GC655-3 vs EP20K400GC655-2X Comparaison
Comparaison détaillée côte à côte de EP20K400GC655-3 par Intel et EP20K400GC655-2X par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400GC655-3 | EP20K400GC655-2X |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $310,00 | $175,00 |
| Series | APEX-20KC | APEX-20KC® |
| Family | APEX 20K | APEX 20K |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 16640 | — |
| Total RAM Bits | 212992 | 212992 |
| Number of Gates | 400000 | — |
| Supply Voltage - Core | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Voltage Tolerance | MultiVolt I/O: 1.8 V / 2.5 V / 3.3 V / 5 V | — |
| Température de fonctionnement | -40C to +85C (industrial) | [DATA_NEEDED: temperature grade] |
| Maximum Frequency | 167 MHz (per FPGAkey) | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Boîtier / Format | 655-BCPGA | — |
| Supplier Device Package | 655-CPGA (62.48 x 62.48 mm) | — |
| Speed Grade | -3 (slowest grade in family) | — |
| Propagation Delay (tPD) | 3.6 ns (per Microchip USA listing) | — |
| JTAG Support | IEEE 1149.1 Boundary-Scan | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Active Serial | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | unknown |
| Logic Elements / Cells | — | 16640 |
| System Gates | — | 400000 |
| Number of I/O | — | 496 |
| Number of Dedicated Inputs | — | 6 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage (MultiVolt) | — | 2.5 V / 3.3 V / 5 V |
| Package Type | — | 655-BCPGA (SPGA655) |
| Package Body Material | — | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | — | 47 x 47 mm |
| Peak Reflow Temperature | — | 220 °C |
| Type de montage | — | Through-hole (CPGA) |
| Programmability | — | In-system, JTAG (IEEE 1149.1) |