EP20K600CF672C9N vs EP20K600CF672 Comparaison
Comparaison détaillée côte à côte de EP20K600CF672C9N par Intel et EP20K600CF672 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Comparaison des spécifications
| Paramètre | EP20K600CF672C9N | EP20K600CF672 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $175,00 | $0,00 |
| Family | APEX 20KC | — |
| Device Type | Loadable PLD / SRAM FPGA | — |
| System Gates | 600,000 | — |
| Logic Elements | 24,320 | [DATA_NEEDED: logic element count] |
| Maximum Operating Frequency | 250 MHz | — |
| Propagation Delay | 1.48 ns (per logic element) | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) | — |
| User I/Os | 488 | — |
| Total Terminals | 672 | — |
| Package Type | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm | 672-ball BGA, FCBGA |
| Process Technology | 0.15 µm all-layer copper | 0.15 um all-layer copper-metal process for supplied family references |
| Température de fonctionnement | 0 C to 85 C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, active serial | — |
| Embedded Memory | MultiCore EABs supporting up to 311,000 RAM bits | [DATA_NEEDED: embedded memory capacity] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |