EP2A15B724C9 vs EP2A40B724C7 Comparaison
Comparaison détaillée côte à côte de EP2A15B724C9 par Intel et EP2A40B724C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A15B724C9 | EP2A40B724C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $268,50 | $650,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | — |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm CMOS, up to 8 metal layers, all-layer copper |
| Maximum Internal Frequency | 500 MHz | 562 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Boîtier | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm |
| Température de fonctionnement | Commercial (0 °C to +85 °C) | 0 °C to +85 °C (commercial) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (lead-bearing FCBGA) |
| Logic Elements / Cells | — | 38,400 |
| Total System Gates | — | 1,500,000 |
| Embedded RAM Bits | — | 655,360 |
| Maximum User I/O | — | 540 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (typ. 1.5 V) |
| PLLs | — | 4 |
| I/O Standards Supported | — | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) |
| Configuration Method | — | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices |
| MultiVolt I/O Support | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| DDR Memory Support | — | Yes (via ESB / I/O circuitry) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |