EP2A25F672C8N vs EP2A25F672I-7 Comparaison
Comparaison détaillée côte à côte de EP2A25F672C8N par Intel et EP2A25F672I-7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A25F672C8N | EP2A25F672I-7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $205,00 | $171,00 |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | 900K (approximately) |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | — |
| User I/Os | 492 | — |
| Boîtier | 672-ball FC-FBGA (FineLine BGA) | 672-pin FC-FBGA |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | -7 |
| Température de fonctionnement | 0 C to 85 C (commercial) | -40C to +85C (Industrial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Type de montage | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Statut RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Cells / Elements | — | 24,320 |
| Maximum Operating Frequency | — | 500 MHz |
| Process Technology | — | 0.15 um |
| Core Voltage | — | 1.5 V |
| Temperature Grade | — | Industrial (I) |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Embedded Memory | — | ESBs (Embedded System Blocks) |