EP2A70F1508I-7 vs EP2A70F1508C9 Comparaison
Comparaison détaillée côte à côte de EP2A70F1508I-7 par Intel et EP2A70F1508C9 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A70F1508I-7 | EP2A70F1508C9 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $140,00 | $1 310,00 |
| Family | APEX II | APEX II FPGA |
| Series | EP2A | APEX II |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 70,000 | — |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Boîtier | 1508-ball FineLine BGA | — |
| Type de montage | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial (I suffix) | — |
| Speed Grade | -7 | C9 |
| Peak Reflow Temperature | 220 C | — |
| Niveau de sensibilité à l'humidité (MSL) | 3 | — |
| Configuration Interface | Serial ROM / Parallel ROM / JTAG | — |
| Embedded Memory | Embedded System Blocks (ESB) for RAM/ROM/FIFO | — |
| Multipliers | Dedicated hardware multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, PCI, GTL+, SSTL | — |
| Design Tool | Quartus II | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Tension d'alimentation | [DATA_NEEDED: VCCINT/VCCIO] | — |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Boîtier / Format | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Température de fonctionnement | — | 0 °C to 85 °C |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |