EP2AGX45DF29I5N vs EP2AGX45DF29I3N Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29I5N par Intel et EP2AGX45DF29I3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29I5N | EP2AGX45DF29I3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $318,00 | $215,00 |
| Device Family | Arria II GX | — |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded Memory (M9K blocks) | 3,517,440 bits | — |
| User I/Os | 364 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | Up to 8 channels, 3.125 Gbps |
| Max Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 4 | — |
| Process Technology | 40 nm | 40 nm |
| Core Supply Voltage | 0.9 V | — |
| Température de fonctionnement | -40C to +100C (industrial) | -40 C to +100 C (industrial) |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Type de montage | Surface Mount | Surface Mount (flip-chip BGA) |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Speed Grade | — | I3 |
| Core Voltage | — | 0.9 V |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Boîtier | — | 780-ball FC-FBGA (DF29) |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |