EP2AGX95DF25C6G vs EP2AGX95DF25I3G Comparaison
Comparaison détaillée côte à côte de EP2AGX95DF25C6G par Intel et EP2AGX95DF25I3G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX95DF25C6G | EP2AGX95DF25I3G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $290,00 | $1 020,00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | 6,839,296 |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | — |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Boîtier | 572-ball FCBGA, 25x25 mm | 572-ball FCBGA |
| Speed Grade | -6 (fastest commercial) | I3 |
| Température de fonctionnement | 0C to 85C (commercial, junction) | -40C to +100C |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Statut RoHS | Compliant | Compliant |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Type de montage | — | Surface Mount (Flip-Chip BGA) |
| Lead-Free | — | Yes |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |
| Configuration Method | — | Serial/Parallel via Altera Quartus II |