EP2S130F1020C3 vs EP2S180F1020C3 Comparaison
Comparaison détaillée côte à côte de EP2S130F1020C3 par Intel et EP2S180F1020C3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2S130F1020C3 | EP2S180F1020C3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 295,00 | $1 280,00 |
| Series | Stratix II | Stratix II |
| Family | Stratix II | — |
| Logic Elements / Cells | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | 8,970 |
| User I/Os | 742 | — |
| Embedded Memory (TriMatrix) | [DATA_NEEDED: total Mbits] | — |
| DSP / Multiplier Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) | — |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Boîtier / Format | 1020-BBGA (FC-FBGA), 33x33 mm | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial, 'C' speed grade) | Commercial (0C to +85C) |
| Speed Grade | C3 (commercial, -3 speed) | C3 |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Boîtier | — | 1020-ball FBGA (flip-chip BGA) |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |