EP3C55U484I7 vs EP3C55U484C6N Comparaison
Comparaison détaillée côte à côte de EP3C55U484I7 par Altera et EP3C55U484C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C55U484I7 | EP3C55U484C6N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $195,00 | $274,06 |
| Family | Cyclone III | Cyclone III |
| Manufacturer | Altera (Intel) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.15 V to 1.25 V | — |
| Logic Elements | 55,856 | 55856 LE |
| Number of LABs/CLBs | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Number of I/O Pins | 327 | — |
| Température de fonctionnement | -40C to +100C (industrial, "I7" grade) | [DATA_NEEDED: operating temperature range] |
| Boîtier | 484-FBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch | 484-FBGA |
| Type de montage | Surface Mount | Surface Mount |
| Maximum Operating Frequency | 437.5 MHz | — |
| Number of PLLs | 4 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Series | Cyclone III | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |