EP3C55U484I7N vs EP3C55U484C6N Comparaison
Comparaison détaillée côte à côte de EP3C55U484I7N par Intel et EP3C55U484C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C55U484I7N | EP3C55U484C6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $188,50 | $274,06 |
| Series | Cyclone III | — |
| Family | Cyclone III FPGA | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 55,856 LE | 55856 LE |
| Adaptive Logic Modules (ALMs) | 3,491 ALM | — |
| Embedded Memory | 2,396,160 bits | 2396160 bit |
| Maximum User I/O | 327 | — |
| Number of LABs/CLBs | 3,491 | — |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | — |
| Température de fonctionnement | -40°C to +100°C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Boîtier | 484-FBGA (UFBGA-484) | 484-FBGA |
| Package Size | 19 x 19 mm, 0.8 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | — | 55856 cells |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |