EP3CLS100F780C8N vs EP3C55F780C8N Comparaison
Comparaison détaillée côte à côte de EP3CLS100F780C8N par Intel et EP3C55F780C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS100F780C8N | EP3C55F780C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $105,80 | $58,20 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | 55,856 |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | 3,491 |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | 377 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Boîtier | 780-ball FBGA (FineLine BGA) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Type de montage | Surface Mount (BGA) | — |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| Statut RoHS | Compliant | Compliant (lead-free FBGA) |
| Lead-Free | Yes | — |
| Series | — | Cyclone III |
| Family | — | Cyclone III (low-cost FPGA) |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Speed Grade | — | 8 (commercial, slowest) |
| Température de fonctionnement | — | 0C to +85C (commercial, 'C' suffix) |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |