EP3SE110F780C4N vs EP3SE110F780I3N Comparaison
Comparaison détaillée côte à côte de EP3SE110F780C4N par Intel et EP3SE110F780I3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndComparaison des spécifications
| Paramètre | EP3SE110F780C4N | EP3SE110F780I3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 395,00 | $1 950,00 |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | — |
| Embedded Memory Bits | 8936448 | 8,936,448 (approximately 1.1 MB) |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | 3 (Fast) |
| Température de fonctionnement | 0C to 85C (Commercial) | -40 °C to +100 °C (Industrial, "I" grade) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Elements | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | — | 65 nm CMOS |
| Boîtier | — | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| PLLs | — | Yes, with global and regional clock networks |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |