EP3SE260F1152I3 vs EP3SE80F1152I4 Comparaison
Comparaison détaillée côte à côte de EP3SE260F1152I3 par Intel et EP3SE80F1152I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)
EP3SE80F1152I4 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SE260F1152I3 | EP3SE80F1152I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $16 500,00 | $2 050,00 |
| Series | Stratix III E (EP3SE260) | — |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | — |
| Température de fonctionnement | -40C to +100C (Industrial) | -40 °C to +100 °C TJ (industrial, 'I' grade) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Fabric Frequency | 500 MHz | — |
| Boîtier | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FineLine BGA (FCBGA) |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | I4 (fastest industrial) |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Family | — | Stratix III E |
| Logic Elements (LE) | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3,200 |
| Embedded Memory (bits) | — | 6,843,392 |
| User I/Os | — | 744 |
| Maximum Operating Frequency | — | 800 MHz |
| Core Supply Voltage | — | 1.1 V |
| Configuration | — | JTAG IEEE Std 1149.1 boundary-scan |
| Architecture | — | ALM-based Adaptive Logic Module |
| Lifecycle | — | Last Time Buy / Legacy (Intel FPGA legacy program) |