EP3SE50F780C3N vs EP3SE110F780C3N Comparaison
Comparaison détaillée côte à côte de EP3SE50F780C3N par Intel et EP3SE110F780C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE50F780C3N | EP3SE110F780C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $717,12 | $1 245,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 4,300 |
| Embedded Memory (M9K blocks) | 312 | — |
| Total Embedded Memory | 5,760 Kbit (5.76 Mbit) | — |
| DSP Blocks | 432 | Yes (integrated, count varies by configuration) |
| Maximum User I/Os | 488 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C3 (medium) | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Boîtier | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |