EP3SL70F484C4N vs EP3SL70F484I4LG Comparaison
Comparaison détaillée côte à côte de EP3SL70F484C4N par Intel et EP3SL70F484I4LG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F484C4N | EP3SL70F484I4LG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $580,00 | $598,00 |
| Family | Stratix III L | Stratix III (low-static-power variant) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,880 | — |
| LABs/CLBs | 2,700 | — |
| Number of Logic Cells / Gates | 67,500 | — |
| Embedded Memory (Block RAM) | 2,699,264 bits (2.7 Mbit) | — |
| Number of I/Os | 296 | — |
| Number of Transceivers | [DATA_NEEDED: number of embedded transceivers] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Speed Grade | -C4 | I4 (industrial, -4 speed bin) |
| Température de fonctionnement | 0C to +85C (Commercial, TJ) | -40 C to +100 C (Industrial) |
| Package Type | 484-ball FCBGA (FineLine BGA) | — |
| Package Code | F484 | — |
| Ball Pitch | 1.0 mm | — |
| Type de montage | Surface Mount | — |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel, Host Bus | — |
| Statut RoHS | Compliant | Compliant (lead-free FCBGA) |
| Niveau MSL | 3 | — |
| Series | — | Stratix III L |
| Process Node | — | 40 nm |
| Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Embedded Block RAM | — | 2.57 Mbit |
| Number of User I/Os | — | 296 |
| Boîtier | — | 484-BBGA, FCBGA |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Style de montage | — | SMD/SMT |
| Programming Toolchain | — | Quartus II / Quartus Prime (Intel FPGA) |