EP3SL70F484I3 vs EP3SL70F484C3 Comparaison
Comparaison détaillée côte à côte de EP3SL70F484I3 par Intel et EP3SL70F484C3 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F484I3 | EP3SL70F484C3 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 013,66 | $810,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | C3 |
| Température de fonctionnement | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Boîtier | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-BBGA / FC-FBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| Statut RoHS | Compliant | — |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 296 |
| Number of Cells | — | 67,500 |
| Internal Frequency (max) | — | 500 MHz (data sheet); 800 MHz (per third-party spec) [DATA_NEEDED: authoritative datasheet figure] |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Type de montage | — | Surface Mount |
| Lead-Free / RoHS | — | Lead-free (per DigiChip listing) |
| Manufacturer | — | Altera (now Intel FPGA) |