EP4CE75F23I7N vs EP4CE75F23I8L Comparaison
Comparaison détaillée côte à côte de EP4CE75F23I7N par Intel et EP4CE75F23I8L par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CE75F23I7N | EP4CE75F23I8L |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $118,00 | $213,30 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | Cyclone IV E |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | 274 |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | — |
| Core Voltage (VCCINT) | 1.2 V nominal | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Boîtier | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-ball FBGA |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | AS, PS, FPP, JTAG |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | — |
| Design Software | Quartus II / Quartus Prime | — |
| Statut RoHS | Compliant | Compliant |
| Logic Elements | — | 75,408 |
| Embedded Memory (bits) | — | 2,810,880 |
| Number of M9K Memory Blocks | — | 305 |
| User I/O Pins | — | 292 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 292 |
| Température de fonctionnement | — | -40C to +85C (Industrial) |
| Supply Voltage (Core) | — | 1.0 V / 1.2 V |
| I/O Standards Supported | — | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL |
| Process Node | — | 60 nm low-leakage |
| Niveau MSL | — | 3 |
| Type de montage | — | Surface Mount (BGA) |