EP4CGX75DF27C7 vs EP4CGX75DF27C8N Comparaison
Comparaison détaillée côte à côte de EP4CGX75DF27C7 par Intel et EP4CGX75DF27C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CGX75DF27C7 | EP4CGX75DF27C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $86,80 | $117,11 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone IV GX | — |
| Logic Cells | 73,920 | — |
| Configurable Logic Blocks | 4,620 | — |
| User I/O | 310 | — |
| Configuration-related Bits | 4,257,792 | — |
| Tension d'alimentation | 1.2 V | — |
| Boîtier | 672-ball FBGA | 672-ball FBGA (F27) |
| Package Body | 27 mm x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Method | — | SRAM-based, requires external config device |
| PCIe Hard IP | — | PCIe Gen1 x1/x2/x4 endpoint |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |