EP4SGX360FF35I3 vs EP4SGX360FF35C4N Comparaison
Comparaison détaillée côte à côte de EP4SGX360FF35I3 par Intel et EP4SGX360FF35C4N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX360FF35I3 | EP4SGX360FF35C4N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 695,00 | $3 550,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Température de fonctionnement | -40C to +100C | — |
| Boîtier | 1152-BBGA, FCBGA (Flip-Chip) | 1152-ball FC-BGA (FF35) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 (Mouser reports 14,144 LABs) |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |