EP4SGX70HF35I3G vs EP4SGX70DF29I3G Comparaison
Comparaison détaillée côte à côte de EP4SGX70HF35I3G par Intel et EP4SGX70DF29I3G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX70HF35I3G | EP4SGX70DF29I3G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 250,00 | $1 080,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 LE | — |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Supply Voltage | 950 mV | 0.87 V to 0.93 V |
| Température de fonctionnement | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | -3 |
| Boîtier | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | — |
| Type de montage | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Package Type | — | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | — | DF29 |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Statut RoHS | — | Compliant |
| Sans halogène | — | [DATA_NEEDED: halogen-free claim] |