EPF10K100EBC356-2 vs EPF10K200SBC600-2 Comparaison
Comparaison détaillée côte à côte de EPF10K100EBC356-2 par Intel et EPF10K200SBC600-2 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 Obsolete
Comparaison des spécifications
| Paramètre | EPF10K100EBC356-2 | EPF10K200SBC600-2 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $59,95 | $85,00 |
| Series | FLEX-10KE | FLEX-10KS |
| Family | Embedded Programmable Logic Device (PLD) | — |
| Typical Gates | 100,000 | 200,000 |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | Yes (for distributed RAM/ROM) |
| Total RAM Bits | 49,152 | — |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | 0.22 micrometer |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | — |
| Température de fonctionnement | 0 C to 70 C (Commercial) | 0 C to 70 C |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Speed Grade | -2 | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | Non-compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | Altera (now Intel) |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| User I/Os | — | 470 |
| Propagation Delay | — | 0.4 ns |
| Voltage - Supply (VCCINT) | — | 2.375 V to 2.625 V |
| Boîtier / Format | — | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | — | 600-BGA |
| Logic Family | — | CMOS (SRAM-based) |
| PLLs | — | 4 |
| Configuration Interface | — | IEEE 1149.1 JTAG |
| MultiVolt I/O | — | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | — | Bulk / Tray |