EPF10K200EBC600-3 vs EPF10K200EBI600-2 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBC600-3 par Intel et EPF10K200EBI600-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200EBC600-3 | EPF10K200EBI600-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $575,00 | $198,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | — |
| Speed Grade | -3 (commercial) | — |
| Boîtier | 600-ball FineLine BGA, 45 x 45 mm | BGA-600, 45 x 45 mm, 1.27 mm pitch |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | 0C to +70C (commercial) | 0 C to 70 C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free package) |
| Logic Elements (LEs) | — | 9,984 |
| Embedded RAM | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 (typical for this density) |
| User I/O Pins | — | 470 |
| Supply Voltage (VCCINT) | — | 2.5 V |
| Propagation Delay | — | 0.4 ns (per -2 speed grade) |
| Logic Family | — | CMOS, SRAM-based |
| Configuration Method | — | JTAG / ByteBlaster (SRAM configuration) |