EPF10K200SFC672-1X vs EPF10K200EFC672-3 Comparaison
Comparaison détaillée côte à côte de EPF10K200SFC672-1X par Intel et EPF10K200EFC672-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200SFC672-1X | EPF10K200EFC672-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $135,00 | $115,00 |
| Series | FLEX-10KS | FLEX 10KE |
| Family | FLEX 10K (legacy) | — |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded Array Blocks (EABs) | 24 | — |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | — |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| Boîtier | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: rohs status] |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Operating Frequency | — | 166.67 MHz |
| Boîtier / Format | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |