EPF10K200SFC672-1X vs EPF10K200SFC672-1 Comparaison
Comparaison détaillée côte à côte de EPF10K200SFC672-1X par Intel et EPF10K200SFC672-1 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K200SFC672-1X | EPF10K200SFC672-1 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $135,00 | $138,75 |
| Series | FLEX-10KS | FLEX 10KE |
| Family | FLEX 10K (legacy) | FLEX 10KE (FLEX-10KS) |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded Array Blocks (EABs) | 24 | 12 |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | — |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Boîtier | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 9984 |
| Total RAM Bits | — | 98304 |
| Number of LABs/CLBs | — | 1248 |
| Number of User I/Os | — | 470 |
| Number of Gates | — | 200K system gates |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (multi-volt) |
| Maximum Operating Frequency | — | 250 MHz |
| Process Technology | — | 0.22 µm CMOS, SRAM-based |
| Package Type | — | 672-ball FBGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Programming Interface | — | JTAG (IEEE 1149.1) + serial/parallel passive configuration |
| Speed Grade | — | -1 |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |