KSZ8001LI vs TLE6250PGV33 Comparaison
Comparaison détaillée côte à côte de KSZ8001LI par Microchip Technology et TLE6250PGV33 par Infineon. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
KSZ8001LI - 10/100 PHY Transceiver, MII/RMII/SMII | Microchip (Tape & Reel)
KSZ8001LI ✓ Actif
Comparaison des spécifications
| Paramètre | KSZ8001LI | TLE6250PGV33 |
|---|---|---|
| Marque | Microchip Technology | Infineon |
| Catégorie | Ethernet Transceivers | Interface ICs |
| Statut du cycle de vie | Actif | Actif |
| Fonction | 10/100BASE-TX/100BASE-FX Physical Layer Transceiver | — |
| Host Interface | MII, RMII, SMII (selectable via strap pins) | — |
| Number of Drivers/Receivers | [DATA_NEEDED: explicit count] | — |
| Supply Voltage (Analog) | 3.3 V | — |
| Supply Voltage (Core) | 1.8 V (internal LDO from 3.3 V) | — |
| Supply Voltage (VDDIO) | 3.3 V or 2.5 V | — |
| Typical Power Consumption | 172 mW | — |
| Cable Reach (TX/Copper) | 130 m+ standard Cat-5 | — |
| Cable Diagnostics | LinkMD TDR, up to 200 m, ±2 m accuracy | — |
| Fiber Support | 100BASE-FX via external transceiver | — |
| Auto-MDIX | Yes (HP Auto-MDIX) | — |
| Auto-Negotiation | IEEE 802.3u Clause 28 | — |
| Reference Clock | 25 MHz (50 MHz for RMII) | — |
| Température de fonctionnement | -40 C to +85 C | — |
| Boîtier | 48-LQFP (7 x 7 mm) | PG-DSO-8 |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (-TR suffix) | — |
| Statut RoHS | Compliant (RoHS3 per distributor data) | Compliant |
| Lead-Free | Yes | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Product Type | — | High-speed CAN transceiver |
| Maximum CAN Data Rate | — | 1 Mbit/s |
| CAN Network Compatibility | — | ISO 11898 |
| Supported Bus Voltage | — | 12 V and 24 V |
| Transceiver Supply Voltage | — | 5 V |
| Operating Mode | — | Standby |
| Implementation | — | Monolithic integrated circuit |
| Signal Mode | — | High-speed differential-mode data transmission |
| Application Category | — | Automotive and industrial applications |
| EMC Performance | — | Manufacturer-listed EMC performance |
| Lead Finish | — | Pb-free |
| Pb-Free Soldering Compatibility | — | Compatible according to IPC/JEDEC J-STD-020 |
| Available Die Option | — | Bare die and PG-DSO-8 package |
| Operating Temperature Grade | — | Automotive temperature grade |
| Verified Distributor Price | — | From $0.2485 as of 2026-10-23 |
| Distributor Availability | — | In stock as of 2026-10-23 |
| Logic Input Levels | — | [DATA_NEEDED: TXD and mode-control input thresholds] |
| Receiver Output Levels | — | [DATA_NEEDED: RXD output voltage and current] |
| Courant d'alimentation | — | [DATA_NEEDED: normal and standby supply current] |
| Bus Fault Protection | — | [DATA_NEEDED: dominant-state bus fault limits] |
| Résistance thermique | — | [DATA_NEEDED: package thermal resistance] |
| ESD Qualification | — | [DATA_NEEDED: ESD HBM and CDM ratings] |