M1AFS1500-1FGG676I vs M1AFS1500-2FG676I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-1FGG676I par Microchip Technology et M1AFS1500-2FG676I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
M1AFS1500-1FGG676I ✓ ActifMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-1FGG676I | M1AFS1500-2FG676I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $405,00 |
| Family | Fusion (Mixed-Signal FPGA) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1.5 M gates | 1.5 M |
| Logic Resources | 276480 bits | — |
| User I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Configuration Memory | Flash (non-volatile, instant-on) | On-chip flash (non-volatile, instant-on) |
| Speed Grade | -1 | 2 |
| Boîtier | 676-pin FBGA (FGG676) | 676-ball FBGA (FG676) |
| Température de fonctionnement | -40C to +85C (industrial) | — |
| Type de montage | Surface Mount | Surface Mount |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) | — |
| Embedded Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) | — |
| Packaging | Tray | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Plage de température de fonctionnement | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |