M1AFS250-2FG256I vs M1AFS250-1FG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-2FG256I par Microchip Technology et M1AFS250-1FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ ActifMicrochip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-2FG256I | M1AFS250-1FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $96,50 |
| Family | Fusion (M1AFS, ARM Cortex-M1 support) | — |
| System Gates | 250K | 250000 gates |
| User I/O | 114 | — |
| Embedded RAM Bits | 36864 | — |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | — |
| System Performance | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (hard IP) | — |
| Configuration Memory | Flash-based, nonvolatile | — |
| Power-Up Mode | Live at Power-Up (LAPU) | — |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) | — |
| Boîtier | 256-ball FBGA (256-LBGA) | 256-LBGA (FBGA) |
| Speed Grade | -2 | -1 |
| Temperature Range | Industrial (-40C to +85C) | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | RoHS Non-Compliant (contains lead; FGG variant is lead-free) | — |
| Packaging | Tray | — |
| Series | — | Fusion (M1 - with ARM Cortex-M1) |
| D Flip-Flops (DFF) | — | 36864 |
| Total I/O | — | 114 |
| Configuration Type | — | Flash-based (live at power-up) |
| Embedded Processor | — | ARM Cortex-M1 soft core |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| On-chip Memory | — | Flash memory blocks |
| Température de fonctionnement | — | -40C to +85C (industrial, suffix I) |
| Package Dimensions | — | 17 mm x 17 mm x 1.2 mm height |
| Supplier Device Package | — | 256-LBGA |
| Total RAM | — | [DATA_NEEDED: Total RAM bits] |
| Embedded Block RAM (eSRAM) | — | [DATA_NEEDED: eSRAM size] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |