M1AFS250-2FG256I vs M1AFS250-1FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-2FG256I par Microchip Technology et M1AFS250-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ ActifMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-2FG256I | M1AFS250-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $0,00 |
| Family | Fusion (M1AFS, ARM Cortex-M1 support) | — |
| System Gates | 250K | 250,000 gates |
| User I/O | 114 | — |
| Embedded RAM Bits | 36864 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | — |
| System Performance | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (hard IP) | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Configuration Memory | Flash-based, nonvolatile | Nonvolatile flash (Live at Power-Up, LAPU) |
| Power-Up Mode | Live at Power-Up (LAPU) | — |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) | — |
| Boîtier | 256-ball FBGA (256-LBGA) | — |
| Speed Grade | -2 | — |
| Temperature Range | Industrial (-40C to +85C) | — |
| Type de montage | Surface Mount | — |
| Statut RoHS | RoHS Non-Compliant (contains lead; FGG variant is lead-free) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Tension d'alimentation de fonctionnement | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Boîtier / Format | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style de montage | — | SMD/SMT |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |