M1AFS250-2FGG256 vs M1AFS250-1FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-2FGG256 par Microchip Technology et M1AFS250-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
M1AFS250-2FGG256 ✓ ActifMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-2FGG256 | M1AFS250-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $83,12 | $0,00 |
| Family | Fusion (M1 series) Mixed-Signal FPGA | — |
| System Gates | 250000 gates | 250,000 gates |
| Registers (D-Flip-Flops) | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | Flash (in-system programmable, instant-on) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Analog Features | Configurable analog block, voltage monitoring | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Boîtier | 256-LBGA (FGG256) | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Speed Grade | -2 | — |
| Total RAM | [DATA_NEEDED: embedded flash memory capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Tension d'alimentation de fonctionnement | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Boîtier / Format | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |