MC68LK332ACEH16 vs MC68332GCEH16 Comparaison
Comparaison détaillée côte à côte de MC68LK332ACEH16 par NXP Semiconductors et MC68332GCEH16 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC68LK332ACEH16 - 32-bit CPU32 MCU, ROMless 132-PQFP | NXP
MC68LK332ACEH16 ✗ Fin de vieNXP Semiconductors
MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
MC68332GCEH16 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MC68LK332ACEH16 | MC68332GCEH16 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $38,75 |
| Core Processor | CPU32 | — |
| Core Size | 32-Bit | — |
| Series | M683xx (MC68332 family) | — |
| Max Clock Frequency | 16.78 MHz | — |
| Program Memory Type | ROMless (external memory) | — |
| SRAM | 2 KB | — |
| Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) | — |
| Intermodule Bus | IMB (common intermodule bus) | — |
| Tension d'alimentation | 5 V | 5 V (typical) |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature Range] | -40C to +85C |
| Boîtier | 132-PQFP (24.13 x 24.13 mm) | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Application Grade | Automotive | — |
| Programmable (ROM/emulation role) | Not verified - ROMless, code from external memory | — |
| Product Status | End of Life (Not For New Designs) | — |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Core | — | CPU32 (M683xx 32-bit) |
| Bit Width | — | 32-bit |
| Maximum Clock Speed | — | 16 MHz |
| Program Memory Size | — | ROMless |
| RAM Size | — | 2 KB (2K x 8) |
| Number of I/O | — | 15 |
| On-chip Peripherals | — | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | — | Intermodule Bus (IMB) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Statut du cycle de vie | — | End-of-Life (Last Time Buy per NXP product page) |