MC9S08AC48CFDE vs MC9S08AC16CFDE Comparaison
Comparaison détaillée côte à côte de MC9S08AC48CFDE par NXP Semiconductors et MC9S08AC16CFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Fin de vieComparaison des spécifications
| Paramètre | MC9S08AC48CFDE | MC9S08AC16CFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,76 | $2,05 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-Bit |
| Speed | 40 MHz CPU / 20 MHz internal bus | — |
| Flash Memory | 48KB (48K x 8) | 16 KB (16K x 8) |
| RAM Size | 8KB | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | — |
| Boîtier | 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad | — |
| Type de montage | Surface Mount | Surface Mount |
| Architecture | CISC, HC08-derived HCS08 | — |
| Series | S08AC (Flexis series) | S08AC (Flexis series) |
| Type de mémoire | Flash (ROM Type: Flash) | — |
| Statut RoHS | RoHS Compliant | RoHS Compliant |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) | — |
| Nombre de broches | 48 | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Peripherals (ADC, timers) | [DATA_NEEDED: peripheral details] | — |
| Fréquence d'horloge maximale | — | 40 MHz |
| Number of I/O | — | 38 |
| Program Memory Type | — | Flash |
| Package Type | — | 48-QFN-EP (7x7 mm), HVQCCN |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Peripherals | — | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] |
| Life Cycle Stage | — | End of Life (per NXP product page) |
| Package Pin Count | — | 48 |
| Packaging | — | Tray |