MC9S08DZ48ACLF vs MC9S08DZ60ACLF Comparaison
Comparaison détaillée côte à côte de MC9S08DZ48ACLF par NXP Semiconductors et MC9S08DZ60ACLF par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08DZ48ACLF - 8-bit S08 MCU, 48KB Flash, CAN, 48-LQFP | NXP
MC9S08DZ48ACLF NrndNXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndComparaison des spécifications
| Paramètre | MC9S08DZ48ACLF | MC9S08DZ60ACLF |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,32 | $6,85 |
| Core Processor | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 48 KB (48K x 8) Flash | — |
| RAM Size | 3 KB | — |
| EEPROM Size | 1.5 KB | — |
| Number of I/O | 39 | — |
| Tension d'alimentation | 2.7 V to 5.5 V | — |
| Température de fonctionnement | -40 C to +85 C | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Boîtier | 48-LQFP (7 mm x 7 mm) | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| A/D Channels | Up to 16 channels, 10/12-bit | — |
| LCD Driver | Yes (integrated) | Yes (on-chip segment LCD driver) |
| MSCAN (CAN 2.0A/B) | Yes | — |
| Statut RoHS | Compliant | Compliant |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| Niveau MSL | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |