MCIMX31LDVKN5DR2 vs MCIMX31CVKN5D Comparaison
Comparaison détaillée côte à côte de MCIMX31LDVKN5DR2 par NXP Semiconductors et MCIMX31CVKN5D par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MCIMX31LDVKN5DR2 - i.MX31 ARM1136 MPU 532MHz MAPBGA-457 | NXP
MCIMX31LDVKN5DR2 ObsoleteNXP Semiconductors
MCIMX31CVKN5D - i.MX31 ARM1136 MPU 532MHz MAPBGA-457 | NXP
MCIMX31CVKN5D ObsoleteComparaison des spécifications
| Paramètre | MCIMX31LDVKN5DR2 | MCIMX31CVKN5D |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $24,50 | $11,88 |
| Core Architecture | ARM1136JF-S (32-bit RISC) | ARM1136JF-S |
| Number of Cores | 1 | — |
| Maximum Core Clock | 532 MHz | — |
| Operating Voltage | [DATA_NEEDED: Vcore range] | — |
| Jazelle Java Acceleration | Yes | — |
| Integrated LCD Controller | Yes (TFT/STN) | — |
| Image Sensor Interface | Yes (CMOS sensor I/F) | — |
| USB Interface | USB 2.0 FS On-The-Go | — |
| External Memory Bus | mDDR / SDRAM controller | — |
| Boîtier | 457-MAPBGA 14x14 mm | 457-LFBGA (MAPBGA-457) |
| Package Pitch | 0.8 mm (Case x 19 mm outline); 0.5 mm inner | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Température de fonctionnement | [DATA_NEEDED: temperature grade] | — |
| Niveau MSL | [DATA_NEEDED] | [DATA_NEEDED: MSL rating] |
| Statut RoHS | [DATA_NEEDED] | [DATA_NEEDED: RoHS status from datasheet] |
| Part Family | — | i.MX31 |
| Core Count | — | 1 |
| Largeur du bus de données | — | 32-bit |
| Fréquence d'horloge maximale | — | 532 MHz |
| Cache Memory | — | 16 KB unified instruction/data |
| Program Memory Type | — | ROMless |
| External Memory Support | — | DDR / SDRAM (external) |
| Package Dimensions | — | 14 x 14 mm |
| Ball Pitch | — | 0.5 mm |
| Process Technology | — | 0.09 um CMOS |
| Plage de température de fonctionnement | — | -40C to +85C (AEC-Q100 Grade 3 automotive) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vcore range] |
| Supply Voltage (I/O) | — | [DATA_NEEDED: Vio range] |
| Automotive Qualification | — | AEC-Q100 Grade 3 (i.MX31 family) |