MPC870CZT133 vs MPC875ZT133 Comparaison
Comparaison détaillée côte à côte de MPC870CZT133 par NXP Semiconductors et MPC875ZT133 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC870CZT133 - MPC8xx 133MHz 32-Bit MPU | NXP | 256-PBGA
MPC870CZT133 ⚠ Dernier achatNXP Semiconductors
MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors
MPC875ZT133 ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC870CZT133 | MPC875ZT133 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $71,00 | $19,85 |
| Part Number | MPC870CZT133 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | MPC8xx (PowerQUICC) | — |
| Core Architecture | PowerPC 32-bit RISC | Power Architecture (PowerPC) 32-bit |
| Number of Cores | 1 | — |
| Core Speed | 133 MHz | — |
| Largeur du bus de données | 32-bit | — |
| Boîtier | 256-PBGA (23x23 mm) | 256-ball PBGA (23x23 mm) |
| Package Code | HBGA, BGA-256 | HBGA, Grid Array with Heat Sink/Slug |
| Terminal Form | Ball | BALL |
| Number of Terminals | 256 | 256 |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Tension d'alimentation | [DATA_NEEDED: supply voltage] | — |
| On-chip Peripherals | Communications Processor Module (CPM), UART, HDLC, USB | — |
| Type de montage | Surface Mount | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Statut RoHS | unknown | [DATA_NEEDED: rohs status] |
| Lead-Free | unknown | — |
| Sans halogène | unknown | — |
| AEC-Q100 Qualified | not_applicable | — |
| Core Count | — | 1 |
| Core Frequency | — | 133 MHz |
| Family | — | MPC8xx / PowerQUICC |
| Température de fonctionnement | — | 0C to +95C |
| Maximum Supply Voltage | — | 1.9 V |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| Statut du cycle de vie | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |