MPC875ZT66 vs MPC870ZT66 Comparaison
Comparaison détaillée côte à côte de MPC875ZT66 par NXP Semiconductors et MPC870ZT66 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC870ZT66 - PowerQUICC 66MHz 32-Bit Comm. Processor | NXP
MPC870ZT66 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC875ZT66 | MPC870ZT66 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Dernier achat |
| Processor Type | MPC8xx communications processor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | — |
| Data Width | 32-bit | — |
| Fréquence d'horloge maximale | 66 MHz | — |
| Tension d'alimentation | 3.3 V | 3.3 V |
| Process Technology | 0.18 µm | 0.18 um |
| Plage de température de fonctionnement | 0 °C to 95 °C | — |
| Package Type | 256-pin PBGA (23 mm x 23 mm) | — |
| Package Code | HBGA | — |
| Terminal Count | 256 | — |
| Package Shape | Square | — |
| Peak Reflow Temperature | 245 °C | — |
| Application Category | Networking and communications applications | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Pinout | [DATA_NEEDED: complete numbered pinout] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC870ZT66 |
| Family | — | PowerQUICC MPC8xx |
| Core Architecture | — | Power Architecture, 32-bit |
| CPU Core Count | — | 1 |
| Maximum CPU Clock | — | 66 MHz |
| Température de fonctionnement | — | 0 C to +95 C |
| Boîtier | — | 256-PBGA (23x23 mm) |
| Type de montage | — | Surface Mount |
| Tray Packaging | — | Tray (per FindIC description) |
| On-chip Memory | — | Dual-port RAM (size not specified in data) |
| Ethernet Controllers | — | 10/100 Mbps Fast Ethernet (FEC) |
| Serial Interfaces | — | HDLC, PCMCIA, I2C, SPI |
| Memory Controller | — | DRAM, SRAM, ROM, Flash |
| Lifecycle | — | End of Life / Last Time Buy per NXP page |