MPX5500D vs MPX5500DP Comparaison
Comparaison détaillée côte à côte de MPX5500D par NXP Semiconductors et MPX5500DP par STMicroelectronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
STMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ ActifComparaison des spécifications
| Paramètre | MPX5500D | MPX5500DP |
|---|---|---|
| Marque | NXP Semiconductors | STMicroelectronics |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,40 | $4,86 |
| Pressure Type | Differential | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 500 kPa | — |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Type de sortie | Analog Voltage | Analog Voltage |
| Plage de tension de sortie | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Tension d'alimentation | 4.75 V to 5.25 V | 5 V (typical) |
| Sensitivity | 9 mV/kPa (nominal) | — |
| Accuracy | ±1.5% (0°C to 85°C) | [DATA_NEEDED: accuracy %FS] |
| Response Time | 1 ms | — |
| Température de fonctionnement | 0°C to 85°C | -40C to +125C (per ST datasheet family) |
| Storage Temperature | -40°C to 125°C | — |
| Boîtier | 6-SIP Module | 6-SIP Module |
| Type de montage | Through-Hole | Through-Hole (SIP) |
| Nombre de broches | 6 | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per ST/NXP product pages) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Courant d'alimentation | — | [DATA_NEEDED: supply current] |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Technology | — | Piezoresistive, Monolithic Silicon |
| Signal Conditioning | — | On-chip, Temperature Compensated |