MSC8157TAG1000A vs MSC8156HAG1000B Comparaison

Comparaison détaillée côte à côte de MSC8157TAG1000A par NXP Semiconductors et MSC8156HAG1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MSC8157TAG1000A MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A ⚠ Dernier achat
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Actif

Comparaison des spécifications

Paramètre MSC8157TAG1000A MSC8156HAG1000B
Marque NXP Semiconductors NXP Semiconductors
Catégorie DSP DSP
Statut du cycle de vie Dernier achat Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $178,00 $198,75
Device Type Six-core Digital Signal Processor (DSP) —
DSP Architecture StarCore SC3850 (6x cores) —
Core Frequency 1 GHz per core —
L1 Instruction Cache 32 KB per core —
L1 Data Cache 32 KB per core —
Unified L2 Cache 512 KB (configurable as M2 in 64 KB increments) —
Accelerator MAPLE-B2 baseband accelerator —
Memory Controller Dual-channel DDR2/DDR3 with ECC —
High-Speed Serial I/O 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI —
Boîtier 783-FCPBGA (29x29 mm) 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Ball Pitch 1.0 mm —
Température de fonctionnement -40C to +105C 0C to +105C
Tension d'alimentation [DATA_NEEDED: core/IO voltage] —
MMU Yes —
Interrupt Controller EPIC (Extended Programmable Interrupt Controller) —
Timers 2x 32-bit general-purpose per core —
Statut RoHS [DATA_NEEDED] Compliant (per distributor datasheet listing)
Niveau MSL [DATA_NEEDED] [DATA_NEEDED: MSL rating]
Product Type — Multi-core Digital Signal Processor (DSP)
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
On-chip ROM — 96 KB
Hardware Accelerator — MAPLE-B (turbo/Viterbi FEC)
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Ethernet — 2 x Gigabit Ethernet (SGMII/RGMII)
Queuing Engine — Yes (QE for packet/traffic management)
Peripheral Interfaces — SPI, I2C, UART, PCI
Process Technology — CMOS
Type de montage — Surface Mount
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)

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