RTAX250SL-1LG624V vs RTAX250SL-1LG624E Comparaison
Comparaison détaillée côte à côte de RTAX250SL-1LG624V par Microchip Technology et RTAX250SL-1LG624E par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
RTAX250SL-1LG624V - 250K-Gate Rad-Tolerant FPGA | Microchip
RTAX250SL-1LG624V ✓ ActifMicrochip Technology
RTAX250SL-1LG624E - 250K Gate Rad-Tolerant FPGA | Microchip
RTAX250SL-1LG624E ✓ ActifComparaison des spécifications
| Paramètre | RTAX250SL-1LG624V | RTAX250SL-1LG624E |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $950,00 | $2 350,00 |
| Equivalent System Gates | 250,000 gates | 250000 |
| Logic Cells | 4224 | 4224 |
| Configurable Logic Blocks (CLBs) | 2816 | 2816 |
| Architecture | CMOS antifuse (Axcelerator-derived) | — |
| Family | RTAX-S/SL Radiation-Tolerant FPGA | RTAX-SL Radiation-Tolerant FPGA |
| Core Supply Voltage | 1.5 V nominal | 1.5 V |
| Speed Grade | -1 | -1 (fastest) |
| Boîtier | 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch | 624-Pin LGA (LG624), ceramic |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -55C to +125C | -55C to +125C |
| Configuration Type | One-Time Programmable (antifuse) | One-time programmable, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clocks, chip-wide highway routing | — |
| Arithmetic Support | Dedicated carry logic | — |
| Application Domain | Space-flight systems | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Total Ionizing Dose Tolerance | [DATA_NEEDED: TID level] | — |
| Maximum Frequency | — | 649 MHz |
| Process Technology | — | 0.15 um CMOS |
| Clocking | — | Segmentable clocks, chip-wide routable reset |
| Packaging Option | — | Box |
| Target Market | — | Space flight systems |