RTAX4000D-1CQ352B vs RTAX4000DL-1CQ352E Comparaison
Comparaison détaillée côte à côte de RTAX4000D-1CQ352B par Microchip Technology et RTAX4000DL-1CQ352E par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
RTAX4000D-1CQ352B - 4M-Gate Rad-Tolerant FPGA 1.5V | Microchip
RTAX4000D-1CQ352B ✓ ActifMicrochip Technology
RTAX4000DL-1CQ352E - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000DL-1CQ352E ✓ ActifComparaison des spécifications
| Paramètre | RTAX4000D-1CQ352B | RTAX4000DL-1CQ352E |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 600,00 | $3 300,00 |
| Family | RTAX-DSP Radiation-Tolerant FPGA | RTAX-S/SL and RTAX-DSP |
| Equivalent System Gates | 4000000 gates | 4,000,000 gates |
| Logic Cells | 55440 cells | [DATA_NEEDED: logic cells] |
| Configurable Logic Blocks (CLBs) | 36960 CLBs | — |
| Core Supply Voltage (Nominal) | 1.5 V | — |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Combinatorial CLB Delay (Max) | 0.99 ns | — |
| Process Technology | 0.15 um CMOS | — |
| Programmability Type | Antifuse (OTP), live at power-up | — |
| Speed Grade | -1 | -1 |
| Boîtier | 352-pin Ceramic CQFP (CQ352) | CQ352 (352-pin ceramic quad flat pack) |
| Type de montage | Surface Mount | — |
| Technology | CMOS, Digital | CMOS, anti-fuse, digital |
| Radiation Tolerance | Radiation-tolerant (space flight) | Radiation-tolerant (space-flight grade) |
| Embedded SRAM | Yes (with built-in FIFO control logic) | — |
| Operating Temperature Bin | B | — |
| Statut RoHS | unknown | — |
| CLB Organization | — | 36,960 CLBs |
| Series | — | RTAX4000DL |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Temperature Screening | — | E (flight screening level) |
| Configuration | — | Live-at-power-up (anti-fuse, single chip) |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clocking | — | Segmentable clocks |
| Routing Features | — | Chip-wide highway routing, carry logic |
| Base Architecture | — | Microsemi Axcelerator |
| Target Applications | — | Space-based / space-flight systems |