S9S08AW60E5MFGER vs MC9S08AW48CFGE Comparaison
Comparaison détaillée côte à côte de S9S08AW60E5MFGER par NXP Semiconductors et MC9S08AW48CFGE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | S9S08AW60E5MFGER | MC9S08AW48CFGE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,05 | $4,05 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tension d'alimentation | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| Boîtier | 44-pin LQFP (10 x 10 mm) | 44-pin LQFP (10x10 mm, 0.5 mm pitch) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BKGD) |
| Température de fonctionnement | -40C to +125C (automotive range) | — |
| Type de montage | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| RAM Size | — | 2 KB |
| I/O Ports | — | 38 (per NXP summary); 34 (per distributor listing) |
| Operating Temperature Grade | — | Industrial |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Instruction Set | — | HC08 with added BGND instruction |
| ROM Type | — | Flash |
| Statut RoHS | — | Compliant |