STL35N75LF3 vs NOPB Comparaison
Comparaison détaillée côte à côte de STL35N75LF3 par STMicroelectronics et NOPB par Texas Instruments. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
STMicroelectronics
STL35N75LF3 - 35V N-Channel Power MOSFET | STMicroelectronics
STL35N75LF3 ✓ ActifComparaison des spécifications
| Paramètre | STL35N75LF3 | NOPB |
|---|---|---|
| Marque | STMicroelectronics | Texas Instruments |
| Catégorie | MOSFETs | Logic ICs |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,55 | $0,00 |
| Polarity | N-Channel | — |
| Drain-Source Voltage (VDS) | 35 V | — |
| Continuous Drain Current (ID) | 35 A | — |
| On-Resistance (RDS(on)) | [DATA_NEEDED: RDS(on) value] | — |
| Gate-Source Voltage (VGS) | [DATA_NEEDED: VGS max] | — |
| Gate Charge (Qg) | [DATA_NEEDED: Qg value] | — |
| Power Dissipation (PD) | [DATA_NEEDED: PD value] | — |
| Plage de température de fonctionnement | -55°C to +150°C | — |
| Boîtier | PowerFLAT 5x6 | — |
| Type de montage | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| ESD Protection | Integrated | — |
| Technology | Strip-layout | — |
| Résistance thermique, jonction-ambiance | [DATA_NEEDED: RthJA value] | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| Température de fonctionnement | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |