XC6SLX25-2FT256I vs XC6SLX25-3FT256C Comparaison
Comparaison détaillée côte à côte de XC6SLX25-2FT256I par AMD et XC6SLX25-3FT256C par Xilinx. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX25-2FT256I | XC6SLX25-3FT256C |
|---|---|---|
| Marque | AMD | Xilinx |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Spartan-6 LX | — |
| Logic Cells | 24,051 | — |
| Configurable Logic Blocks (CLBs) | 1,879 | — |
| Block RAM (Kbits) | 958 | — |
| Distributed RAM (Kbits) | 4,824 | — |
| DSP48A1 Slices | 38 | — |
| User I/O | 186 | — |
| Clock Management Tiles (CMTs) | 2 | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | -2 (standard) | — |
| Temperature Grade | -I (Industrial, -40C to +100C) | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Boîtier | FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch | 256-pin FTBGA, 17 x 17 mm, 1 mm pitch |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s) | — |
| Type de montage | Surface Mount (BGA) | Surface mount |
| Statut RoHS | Compliant (Pb-free) | [DATA_NEEDED: RoHS status] |
| Device Type | — | Spartan-6 LX field-programmable gate array |
| Logic Elements | — | 24,051 cells |
| Adaptive Logic Modules | — | 3,758 ALMs |
| Configurable Logic Blocks | — | 1,879 CLBs |
| Embedded Memory | — | 936 kbit |
| Input/Output Count | — | 186 I/O |
| Core Voltage | — | 1.2 V |
| Performance Figure | — | 667 MHz |
| Terminal Count | — | 256 balls |
| Package Shape | — | Square |
| Temperature Grading | — | Other |
| Lead-Free Status | — | Lead free |
| Unit Price | — | $24.3384 as of 2026-10-28 |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |